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聯(lián)系我時(shí)，請(qǐng)告知來(lái)自 環(huán)保在線OKAMOTOGDM300晶圓拋光/晶圓背拋概要：ModelGDM300grinderisafullyautomaticcontinuousdownfeedgrindingmachinewithdualpolishingstationsforincreasedthroughput
OKAMOTO GDM300晶圓拋光/晶圓背拋概要： |
Model GDM300 grinder is a fully automatic continuous downfeed grinding machine with dual polishing stations for increased throughput. Wafers are handled through the machine by a 6-axis robot, and load/unload arms designed for 25 um capability. An optional edge trimming system is recommended for eliminating edge chipping for thin wafers. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2 with an optional laser detection for a more precision thickness accuracy (recommended for < 50 um). Programmable oscillating polish heads can be programmed to maintain wafer profile (ttv) in conjunction with with the optional motorized spindle angle adjustment. After completion at grind and polish, wafer is automatically transferred by robot to the mounter unit for UV exposure, detape, and mount. Pre-cut DAF feature is optional while single DAF is included. Coin-stack feature may be integrated. The local polishing unit removes subsurface damage for increased wafer die strength and the ability to handle final thickness of 25 microns.
OKAMOTO GDM300晶圓拋光/晶圓背拋特點(diǎn)： |
The process from back grinding to wafer mounting continuously by fully automatic system, Which enable to grind till 25um thickness. |
With 2 head polishing stage, throughput is almost double compared with 1 polish head system. |
Built in edge trimming system is available as an option for thin wafer process. |
Dual index system, which polishing stage and grinding stage is completely separated, satisfy the cleanness required for TSV and MEMS process. |
Less than Ra1? ultra luminance, ultra mirror surface is possible. |
OKAMOTO GDM300晶圓拋光/晶圓背拋規(guī)格參數(shù)： |
Maximum wafer- machining diameter of wafer | 12" |
Grinding Spindle: Bearing type Motor Rapid feed speed Grind feed speed | Air bearing, maximum 3000 rpm 5.5 kw, 4P, high frequency motor 240 mm/min 1 to 999 µm/min |
Grinding wheel size | ?300 mm |
Index Table: Number of work spindles Work spindle Bearing type Speed of Work Spindles | 3 Air Bearing 1 to 300 rpm |
Automatic Sizing Device: Wafer thickness measuring system Wafer minimum setting size resolution Wafer size display range | 2 point contact in-process gauge,Laser Detection (Opt.) 0.1 µm 0to 1.6 mm; extended range software available |
Table Cleaning Device (Grinder side) | DI Water + Ceramic block |
Wafer Cleaning Unit (Grinder side) | DI Water + Brush |
Edge Trimming Device (Optional): Max Spindle Speed Accuracy | Recommended for < 50 um. 1800 rpm +/- 5 µm |
Number of Cassettes | 2 cassette stations |
Polish Station: Work Spindle Polish head Oscillation speed Head Load Pad size | 2High Precision Ball Bearing Work Spindles on Index Table 3Kw AC servo motor for 10 – 320 rpm 100 – 9,000 mm/min. 0 – 0.5 Kg/cm2 240mm for 300mm, 160mm for 200mm |
Polish table speed Vacuum Chuck material | 3 Kw AC servo motor for 550 rpm max Alumina ceramics + porous ceramics |
Integrated Mounter System: Robot Vacuum Chuck Handling pads UV Irradiating Single DAF/Pre-Cut DAF Coin-Stack | 6-Axis Mitsubishi Robot Porous Carbon Fiber Vacuum Chucks Carbon Fiber Handling Pads Standard UV Irradiation system Single DAF included/Pre-Cut DAF Optional Coin-Stack Included |
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